Extremely thin metallic and ceramic layers with high uniformity on square meter panes are now industrial standard. However, the established magnetron sputtering process still faces the constant challenge of reducing costs, improving process stabilization over long periods of time and further simplifying maintenance.

In addition to increasing material utilization, reducing micro-arc discharges and suppressing unwanted dust and particles in the coating sources, the crucial issues are the intelligent interaction between the necessary electrical power supplies and the coating sources.



Target utilization

The magnetron sputtering process for the deposition of extremely thin metallic or ceramic layers on flat substrates of up to 18 m² is industrial standard. This means that further improvement in economic efficiency is in the focus of development.

With the introduction of tubular sputtering targets, there was a real boost in terms of material utilization but also in deposition rates. This approach achieves sputter material utilization in the range of up to 80%, a significant improvement compared to approx. 50% with the technically complex dynamic planar cathode and approx. 35% with the static planar cathode.

Our Products

RTM25/80 Rotating tube magnetron

NMS Table top sputtering systems for precious metals

NMS 450 Batch system for high productivity

Special mechanical engineering

We at W&L Coating Systems are working to further improve the three decisive factors for the economic viability of magnetron sputtering cathodes.

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